RIT SNL Fab Services and Capabilities

The capabilities of the SNL include:

Wafer cleaning, ion implantation and diffusion, and high temperature processing both with conventional tube furnaces and RTP systems.

CVD / PECVD deposition capabilities are available for oxides, nitrides, and polysilicon. A variety of vacuum systems are available for sputtering and thermal evaporation of metals and dielectrics.

Lithography, including automated coating and development systems combined with a set of two 5:1 steppers with capabilities down to 0.40 microns, as well as 1:1 contact lithography and an electron beam exposure system for photo mask production.

Plasma etch capabilities for silicon, oxides, nitrides, and metals and provision for a broad variety of wet chemical etch processes as well as copper electroplating and CMP.

Complete prototyping of devices and systems with help from the electrical and surface analytical characterization labs, microelectronics layout and computer simulation facilities, and in-house industry-standard electronics packaging capability.

The RIT SNL offers a wide range of services from single process up to foundry services.
It is by no means a complete list, please contact us so that we can discuss your needs.

Foundry Services

The SNL has a 2um CMOS process with an effective L of 1.5um.

We have run this process for customers using their design and incorporating our test structure for test verification.
Aluminum and Tungsten gate metals have been processed - others are possible.
Our Vt's are well matched but implant splits are possible.
Typical run time is ~8 weeks

Details about the RIT SMFL CMOS Process, Performance, Specifications, and Options

If you require this information or a quote on your process, please contact T. Grimsley

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