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STS ASE Deep Silicon Etch

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Created by Sean O'Brien on May 26, 2022

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Facts

The STS ASE Deep Silicon Etch is a loadlocked system.
The process gases are C₄F₈, SF₆, O₂ and Ar.
No metals allowed.

Personnel

Tool Engineer - Rich Battaglia and Bruce Tolleson
Process Engineer - Sean O'Brien
Super User - Patricia Meller
Any of these personnel can certify new users

Tool & Process Information

STS Process Information

Manuals & Users

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