Tool Set
Tool Set Links
Tool Groups
Lithography
Tool | Use | |
---|---|---|
Required | 5x Stepper for exposure of 100mm substrates - g-line | |
Required | 5x Stepper for exposure of 150mm substrates - i-line | |
Heidelberg DWL 66+ | Required | Exposure system for direct write or maskmaking |
Required | 1x Contact Aligner for exposure of 150mm substrates - broadband/i-line | |
Required | 1x Contact Aligner for exposure of multiple size substrates - broadband | |
Required | Coat/Develop track for 150mm substrates | |
Required | Coat/Develop track for 150mm substrates | |
Required | Manual Coat for photoresist only - multiple sizes | |
Required | Manual Coat for SU8 / Polyimides / SOG -multiple sizes | |
CEE Resist Coat Station | Required | Manual HMDS Prime and manual Coat for photoresist only - 100/150mm |
Required | Manual Develop for photoresist - 100/150mm |
Physical Vapor Deposition
Tool | Use | |
---|---|---|
Required | DC sputter of metals / conducting targets | |
Required | RF Sputter of conducting and insulating targets, loadlocked | |
Required | Eight pocket electron beam evaporation | |
Required | Flash evaporation of Al wire | |
Required | Thermal evaporation | |
Required | Sputtering of gold on SEM samples |
Dry Etch
Tool | Use | |
---|---|---|
Required | Reactive Ion Etching of silicon dioxide | |
Plasmatherm ICP Cl Etch | Required | Used for dry etching of III-V substrates - chlorine |
Trion Apollo Asher | Required | Used for O2 plasma ash removal of photoresist |
Required | Used for reactive ion etching of silicon dioxide | |
Trion Phantom III Reactive Ion Etcher | Required | Used for reactive ion etching of silicon & silicon nitride |
Trion ICP RIE | Required | |
STS ASE Deep Silicon Etcher | Required | Deep silicon etching using the Bosch Process |
Required | Used for surface release etching of silicon |
Thermal & Implant
Tool | Use | |
---|---|---|
Required | Rapid Thermal Anneal of clean, MOS grade wafers | |
Required | Used for wet oxidation of silicon substrates | |
Required | Used for diffusion of p-type dopants | |
Required | Used for diffusion of n-type dopants | |
Required | Used for dry oxidation of silicon substrates | |
Required | Fitted with external torch for low temp wet oxide growth | |
Required | Used for wet oxidation of silicon substrates | |
Required | Used for low temperature anneals | |
Required | Used for high temperature anneals - Contamination threat substrates | |
Required | Used for implantation of boron and phosphorous |
Wet Chemical Process
Tool | Use | |
---|---|---|
Required | Tank for aluminum etching & two tanks for solvent strip of photoresist. | |
Required | Wet Bench with tanks for BOE, Pad Etch, & HF etching of oxides. | |
Required | Used for RCA Clean of wafers | |
Required | Used for general purpose manual chemical processing | |
Required | Used for general purpose manual chemical processing & HCl Decontamination | |
Required | Used for general purpose manual chemical processing | |
Required | Used for general purpose manual chemical processing | |
Required | Used for RCA Clean of wafers before gate oxidation | |
Required | Etching of Nitride with heated phosphoric and silicon etching with heated KOH | |
Required | Used for the ultrasonic cleaning of silicon wafers - also used in liftoff processes. |
Chemical Vapor Deposition
Tool | Use | |
---|---|---|
Required | 4" and 6" TEOS at 390C | |
Trion PECVD | Required | Deposition of nitride/poly Si on III-V substrates |
Ultratech S200 ALD | Required | Deposition of atomic layer films |
Metrology
Tool | Use | |
---|---|---|
None | Optical linewidth measurement | |
None | Optical microscope with image capture | |
None | Optical microscope with Nomarski | |
None | Measurement of oxide, nitride | |
Required | Ellipsometry of thin films | |
Required | Ellipsometry using variable angle, multi spectral | |
Required | Dynamic measurement of step heights using interferometry | |
Required | Measurement of film resistivity | |
Required | Profilometer measurement of film steps |
Dicing
Tool | Use | |
---|---|---|
Required | Dicing of Silicon, Glass, ceramic substrates | |