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  • Any of these personnel can certify new users

Manuals

Process Information

  • Plasma cleans are run before and after depositions to prevent the buildup from peeling off of the chamber.

  • A Plasma Clean must be run after every one micron of TEOS Deposition. 
    • For multiple micron depositions, the wafer must removed after each micron of deposition so that the chamber can be cleaned.

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