AME P5000 Chamber A

Facts

The AME P5000 is a multi-chamber tool set up for a variety of processes

• Chamber A - PECVD of TEOS Silicon Dioxide
• TEOS is heated and brought into the chamber where it is subjected to an RF plasma and a heated chamber at 300 to 390C
• No gold or copper coatings allowed.

• Other Chambers
  • AME P5000 Chamber C - RIE of Silicon Dioxide

Personnel

• Tool Engineer - John Nash
• Process Engineer - Sean O'Brien
• Super User - Patricia Meller
• Super User - Eli Powell
• Super User - William Huang

• Any of these personnel can certify new users

Manuals

• P5000 Manual - Rev H - 4/6/17

• P5000 Certification Checklist - 9/17/09

Process Information

• Plasma cleans are run before and after depositions to prevent the buildup from peeling off of the chamber.

• A Plasma Clean must be run after every one micron of TEOS Deposition. 
  • For multiple micron depositions, the wafer must removed after each micron of deposition so that the chamber can be cleaned.