Heidelberg DWL 66 Laser Writer

Facts

• The DWL 66+ is a high-resolution imaging system developed to expose photoresist coatings on a variety of substrates.
  • Substrates up to 8" x  8" can be exposed.
  • Exposure wavelength is 405nm from a solid state laser.
  • The system is also the SMFL maskmaking tool.

• Design data can be created by any program using DXF, Gerber, GDSII, or CIF format.

• 3D structures in thick photoresist can be created by using the Advanced Gray Scale Exposure Mode.

• Two lenses are available
  • 20mm head - 4.0um features
  • 4mm head - 0.8 um features

Personnel 

• Tool/Process Engineer - Sean O'Brien
• Superuser - Eli Powell
• Any of these personnel can certify new users

Tool & Process Information

• Heidelberg DWL 66+ Fact sheet

Manuals & Users

• Heidelberg Users Manual - Rev B - 5/13/17