Oxide Etch

SiO₂ etching may be done in a variety of chemical etchants found in the lab, as outlined below.
Custom mixtures are labeled with the name of the owner and may contain process contaminants. Please contact owner before use.
Tanks that are not labeled with an owner are available for general use.
All wafers should be rinsed for 5 minutes before going into the rinser/dryer.
Do not add water to any of the tanks. Contact a staff member to top off or change a tank.
Always verify etch rates before use.

Etchant	Purpose
10:1 Buffered Oxide Etch (BOE)	General purpose oxide etching and removal
10:1 Buffered Oxide Etch with Surfactant	Oxide etching of smaller features
5.2:1 Buffered Oxide Etch	Oxide etching when a faster etch rate is desired
Pad Etch	Used to etch oxide that has been deposited over aluminum. Etches aluminum at a reduced rate.
50:1 HF	Used as part of an RCA Clean to remove trace amounts of oxide.
Custom mix	Contact owner.